Introducing HBM, a new type of memory chip with low power consumption, ultra-wide communication lanes and a revolutionary new stacked configuration. HBM’s vertical stacking and fast information transfer open the door for truly exciting performance in innovative form factors. And GPU applications are just the start – look for HBM’s superior power efficiency and space savings to spark industry-wide innovation.
Revolutionary HBM breaks the processing bottleneck
Performance well beyond DDR4/GDDR5/LPDDR4
>3X the performance per watt of GDDR5
SMALL FORM FACTORS
94% less PCB surface area than GDDR5
New interconnects, interposer & DRAM type designed by AMD