This Peltier works very well as long as you remove the heat from the hot side. After turning on the device, the hot side will heat quickly, the cold side will cool quickly. If you do not remove the heat from the hot side (with a heat sink or other device), the Peltier will quickly reach stasis and do nothing. We recommend using an old computer CPU heatsink or other block of metal to pull heat from the hot side. We were able to use a computer power supply and CPU heatsink to make the cold side so uncomfortable we could not hold our finger to it.
A thermoelectric cooling (TEC) module is a semiconductor-based electronic component that functions as a small heat pump. By applying DC power source to a TEC, heat will be transferred from one side of the module to the other. It creates a cold and hot side. They are widely used in industrial areas, for example, computer CPU, CCDs, portable refrigerators, medical instruments, and so on.
There are 127 couples in single module; 40mm x 40mm size module is a single stage module which is designed for cooling and heating up to 90C applications.
Also Known as Thermoelectric cooling modules, Thermoelectric modules, Peltier modules, Thermoelectric cooling module.
Important Note: Heat side requires heat sink all the time. Do not run this device with a power supply more than a few seconds without a heatsink mounted to the device!
Operating Tips :
1. The hot surface Th of the TEC must be attached to a suitable FAN SINK (60x60x40+mm) that is capable of carrying away both the heat pumped by the TEC plus Joule heat from the electric power supplied to the TEC. A heat sink rise of 15C above ambient is typical for many TEC applications. Otherwise, a bigger heat sink must be used to reduce temperature.
2. Care should be taken when applying pressure during installation. Uniform pressure is desired across the mounting surfaces. If uneven pressure is applied, thermal performance may be reduced or damage may occur to the TEC.
3. Clean surface thoroughly, making sure there are no chips, dirt or any foreign substances that may affect bonding. Coat the contacting sides, Th and Tc, with thermally conductive grease or glue.
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